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30Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle With Low Power

30Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle With Low Power

MOQ: 1 UNIT
Price: Negotation
Standard Packaging: Packed by carton
Payment Method: T/T, Western Union
Supply Capacity: 1000 unit per month
Detail Information
Place of Origin
CHINA
Brand Name
FUNSONIC
Certification
CE
Model Number
FSW-3002-L
Production Name:
30Khz Scattering Ultrasonic Nozzle Atomization
Frequency:
30Khz
Max Power:
50w
Automized Particle Size Range:
15-40μm
Spray Flow:
0.5-20ml
Liquid Viscosity:
<30cps
Particle Size:
<12μm
Application:
Suitable For Full Surface Spraying Of Flux
Highlight:

Low Power Ultrasonic Spray Scattering Nozzle

,

Semiconductor Lens Ultrasonic Spray Scattering Nozzle

,

30Khz Ultrasonic Spray Scattering Nozzle

Product Description

30Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle with Low Power

 

 

Description: 

 

The typical application of scattering type ultrasonic nozzles is the photoresist coating on semiconductor chips, where the photoresist is sprayed onto the semiconductor chips. Due to the rotational scattering of mist emitted by the scattering type ultrasonic nozzle, a uniform photoresist film can be formed not only on the wafer plane, but also on the sidewalls and corners of the wafer microstructure. In addition, scattering ultrasonic nozzles can also be used for thin film solar cell coatings, calcium titanate solar cell coatings, AR transmission and reflection film coatings, insulation film coatings, superhydrophobic coating coatings, PCB flux coatings, and other applications.

 

 

Parameters: 

 

Model FSW-3002-L
Name 30Khz Scattering Ultrasonic Nozzle Atomization
Frequency 30Khz
Atomized particle size range(μm) 15-40
Spray width(mm) 40-80
Spray flow(ml/min) 0.5-20
Spray height(mm) 30-80
Liquid viscosity (cps) <30
Particle size (μm) <15
Diversion pressure (Mpa) <0.05
Application Suitable for Photoresist coatings on semiconductor chips

 

 

Advantages:

 

1. Large surface spraying, spraying width: 40-150mm

2. Coating uniformity:>95% uniformity

3. Saving raw materials: The utilization rate of raw materials is over 85%, which is 4 times higher than traditional two fluid spraying

4. High precision in coating thickness control: can prepare coatings ranging from 20nm to tens of micrometers, with precise control of coating thickness

5. Fine atomized particles

6. Uniform atomization of particles

7. It can be sprayed intermittently or continuously

8. Ultra low spray flow

9. Will not block the nozzle

10. Anti corrosion nozzle

11. High precision and controllable spraying

 

 

30Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle with Low Power

 

30Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle With Low Power 030Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle With Low Power 1

products
PRODUCTS DETAILS
30Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle With Low Power
MOQ: 1 UNIT
Price: Negotation
Standard Packaging: Packed by carton
Payment Method: T/T, Western Union
Supply Capacity: 1000 unit per month
Detail Information
Place of Origin
CHINA
Brand Name
FUNSONIC
Certification
CE
Model Number
FSW-3002-L
Production Name:
30Khz Scattering Ultrasonic Nozzle Atomization
Frequency:
30Khz
Max Power:
50w
Automized Particle Size Range:
15-40μm
Spray Flow:
0.5-20ml
Liquid Viscosity:
<30cps
Particle Size:
<12μm
Application:
Suitable For Full Surface Spraying Of Flux
Minimum Order Quantity:
1 UNIT
Price:
Negotation
Packaging Details:
Packed by carton
Payment Terms:
T/T, Western Union
Supply Ability:
1000 unit per month
Highlight

Low Power Ultrasonic Spray Scattering Nozzle

,

Semiconductor Lens Ultrasonic Spray Scattering Nozzle

,

30Khz Ultrasonic Spray Scattering Nozzle

Product Description

30Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle with Low Power

 

 

Description: 

 

The typical application of scattering type ultrasonic nozzles is the photoresist coating on semiconductor chips, where the photoresist is sprayed onto the semiconductor chips. Due to the rotational scattering of mist emitted by the scattering type ultrasonic nozzle, a uniform photoresist film can be formed not only on the wafer plane, but also on the sidewalls and corners of the wafer microstructure. In addition, scattering ultrasonic nozzles can also be used for thin film solar cell coatings, calcium titanate solar cell coatings, AR transmission and reflection film coatings, insulation film coatings, superhydrophobic coating coatings, PCB flux coatings, and other applications.

 

 

Parameters: 

 

Model FSW-3002-L
Name 30Khz Scattering Ultrasonic Nozzle Atomization
Frequency 30Khz
Atomized particle size range(μm) 15-40
Spray width(mm) 40-80
Spray flow(ml/min) 0.5-20
Spray height(mm) 30-80
Liquid viscosity (cps) <30
Particle size (μm) <15
Diversion pressure (Mpa) <0.05
Application Suitable for Photoresist coatings on semiconductor chips

 

 

Advantages:

 

1. Large surface spraying, spraying width: 40-150mm

2. Coating uniformity:>95% uniformity

3. Saving raw materials: The utilization rate of raw materials is over 85%, which is 4 times higher than traditional two fluid spraying

4. High precision in coating thickness control: can prepare coatings ranging from 20nm to tens of micrometers, with precise control of coating thickness

5. Fine atomized particles

6. Uniform atomization of particles

7. It can be sprayed intermittently or continuously

8. Ultra low spray flow

9. Will not block the nozzle

10. Anti corrosion nozzle

11. High precision and controllable spraying

 

 

30Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle with Low Power

 

30Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle With Low Power 030Khz Semiconductor Lens Ultrasonic Spray Scattering Nozzle With Low Power 1

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