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Ultrasonic Semiconductor Wafer Coating Continuous

Ultrasonic Semiconductor Wafer Coating Continuous

MOQ: 1 UNIT
Price: Negotation
Standard Packaging: Packed by Wooden Case
Payment Method: T/T, Western Union
Supply Capacity: 1000 unit per month
Detail Information
Place of Origin
CHINA
Brand Name
FUNSONIC
Certification
CE
Model Number
FS620
Production Name:
Ultrasonic Precision Spraying Machine
Frequency:
20-200khz
Max Power:
1-15W
Continuous Spraying Volume Max:
20-1200ml/h/pcs,Scalable
Effective Spraying Width:
2-260mm/pcs,Scalable
Spray Uniformity:
≥95%
Solution Viscosity:
≤30cps
Input Voltage:
220V±10%/50-60Hz
Highlight:

Ultrasonic Semiconductor Wafer Coating

,

Semiconductor Wafer Coating

,

Ultrasonic Wafer Coating

Product Description

Ultrasonic Semiconductor Wafer Coating


 
Description: 

 

Wafer coating is a unique process that facilitates the automatic application of chip bonding adhesives at the wafer level, followed by the formation of chip bonding films in the next stage. FUNSONIC's ultrasonic semiconductor wafer coating technology is suitable for wafer coating, which can achieve process speed, thickness control, and material uniformity. After the hot or UVB stage and wafer cutting, chip connections are achieved through heating and pressure to produce consistent adhesive lines and small, controlled corners.

Ultrasonic semiconductor wafer coating technology needs to consider spraying parameters during use, such as ultrasonic frequency, spraying speed, and coating thickness, which need to be optimized according to specific materials and requirements; At the same time, material properties can also have a certain impact on the spraying effect, such as the viscosity, surface tension, and volatility of the coating, which need to be considered when selecting materials.

 


Parameters: 

 

Product Type Intelligent Ultrasonic Precision Coating Machine desktop Type FS620
Spray Nozzle Operating Frequency 20-200Khz
Nozzle Power 1-15W
Continuous Spraying Volume Max 0.5-10ml/min
Effective Spraying Width 2-20mm
Spray Uniformity ≥95%
Solution Conversion Rate ≥95%
Dry Film Thickness 20nm-100μm
Solution Viscosity ≤30cps
Temperature Range 1-60℃
Atomized Particles (Median Value) 15-40μm (distilled water), determined by the frequency of the nozzle
Diversion Pressure Max ≤0.05MPA
Input Voltage 220V±10%/50-60Hz
Exercise Mode XYZ three-axis, independently programmable
Control Mode FUNSONIC spraying control system, PLC control, 13.3-inch full-color touch screen
Control Content Ultrasonic spraying, liquid supply, heating, ultrasonic dispersion and other systems
Liquid Supply Method Precision injection pump
Ultrasonic Dispersion System (Optional) 20ml or 50ml, 40K, biological grade sampler
Rated Power of Ultrasonic Dispersion System 100W


 

Application : 

 

1. Coating of photosensitive layer:
In photolithography, ultrasonic technology is used to uniformly coat photosensitive materials, ensuring high-resolution pattern transfer.
2. Protective coating:
Apply anti-corrosion and scratch resistant protective coatings to enhance the durability of the wafer.
3. Functional coating:
In certain applications, functional materials with specific electrical or optical properties can be coated.


   Ultrasonic Semiconductor Wafer Coating Continuous 0

Ultrasonic Semiconductor Wafer Coating Continuous 1

 

Ultrasonic Semiconductor Wafer Coating Continuous 2

 

 

Ultrasonic Semiconductor Wafer Coating

 

Ultrasonic Semiconductor Wafer Coating Continuous 3

 

Ultrasonic Semiconductor Wafer Coating Continuous 4

products
PRODUCTS DETAILS
Ultrasonic Semiconductor Wafer Coating Continuous
MOQ: 1 UNIT
Price: Negotation
Standard Packaging: Packed by Wooden Case
Payment Method: T/T, Western Union
Supply Capacity: 1000 unit per month
Detail Information
Place of Origin
CHINA
Brand Name
FUNSONIC
Certification
CE
Model Number
FS620
Production Name:
Ultrasonic Precision Spraying Machine
Frequency:
20-200khz
Max Power:
1-15W
Continuous Spraying Volume Max:
20-1200ml/h/pcs,Scalable
Effective Spraying Width:
2-260mm/pcs,Scalable
Spray Uniformity:
≥95%
Solution Viscosity:
≤30cps
Input Voltage:
220V±10%/50-60Hz
Minimum Order Quantity:
1 UNIT
Price:
Negotation
Packaging Details:
Packed by Wooden Case
Payment Terms:
T/T, Western Union
Supply Ability:
1000 unit per month
Highlight

Ultrasonic Semiconductor Wafer Coating

,

Semiconductor Wafer Coating

,

Ultrasonic Wafer Coating

Product Description

Ultrasonic Semiconductor Wafer Coating


 
Description: 

 

Wafer coating is a unique process that facilitates the automatic application of chip bonding adhesives at the wafer level, followed by the formation of chip bonding films in the next stage. FUNSONIC's ultrasonic semiconductor wafer coating technology is suitable for wafer coating, which can achieve process speed, thickness control, and material uniformity. After the hot or UVB stage and wafer cutting, chip connections are achieved through heating and pressure to produce consistent adhesive lines and small, controlled corners.

Ultrasonic semiconductor wafer coating technology needs to consider spraying parameters during use, such as ultrasonic frequency, spraying speed, and coating thickness, which need to be optimized according to specific materials and requirements; At the same time, material properties can also have a certain impact on the spraying effect, such as the viscosity, surface tension, and volatility of the coating, which need to be considered when selecting materials.

 


Parameters: 

 

Product Type Intelligent Ultrasonic Precision Coating Machine desktop Type FS620
Spray Nozzle Operating Frequency 20-200Khz
Nozzle Power 1-15W
Continuous Spraying Volume Max 0.5-10ml/min
Effective Spraying Width 2-20mm
Spray Uniformity ≥95%
Solution Conversion Rate ≥95%
Dry Film Thickness 20nm-100μm
Solution Viscosity ≤30cps
Temperature Range 1-60℃
Atomized Particles (Median Value) 15-40μm (distilled water), determined by the frequency of the nozzle
Diversion Pressure Max ≤0.05MPA
Input Voltage 220V±10%/50-60Hz
Exercise Mode XYZ three-axis, independently programmable
Control Mode FUNSONIC spraying control system, PLC control, 13.3-inch full-color touch screen
Control Content Ultrasonic spraying, liquid supply, heating, ultrasonic dispersion and other systems
Liquid Supply Method Precision injection pump
Ultrasonic Dispersion System (Optional) 20ml or 50ml, 40K, biological grade sampler
Rated Power of Ultrasonic Dispersion System 100W


 

Application : 

 

1. Coating of photosensitive layer:
In photolithography, ultrasonic technology is used to uniformly coat photosensitive materials, ensuring high-resolution pattern transfer.
2. Protective coating:
Apply anti-corrosion and scratch resistant protective coatings to enhance the durability of the wafer.
3. Functional coating:
In certain applications, functional materials with specific electrical or optical properties can be coated.


   Ultrasonic Semiconductor Wafer Coating Continuous 0

Ultrasonic Semiconductor Wafer Coating Continuous 1

 

Ultrasonic Semiconductor Wafer Coating Continuous 2

 

 

Ultrasonic Semiconductor Wafer Coating

 

Ultrasonic Semiconductor Wafer Coating Continuous 3

 

Ultrasonic Semiconductor Wafer Coating Continuous 4

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